Kurzinfo: IBM - Memory - 2 GB - für System Storage DS3512, DS3524, EXP3512 Gruppe RAM Hersteller IBM Hersteller Art. Nr. 68Y8434 Modell EAN/UPC 5052179747595 Produktbeschreibung: IBM Memory - 2 GB Produkttyp RAM-Speicher Kapazität 2 GB Erweiterungstyp Systemspezifisch Entwickelt für System Storage DS3512 Model C2A, DS3524 Model C4A, EXP3512 Storage Expansion Unit Model E2A Ausführliche Details Allgemein Kapazität 2 GB Erweiterungstyp Systemspezifisch Speicher Typ DRAM Erweiterung/Konnektivität Kompatible Steckplätze 1 x Speicher Informationen zur Kompatibilität Entwickelt für IBM System Storage DS3512 Model C2A, DS3524 Model C4A, EXP3512 Storage Expansion Unit Model E2A
Kurzinfo: MemorySolutioN - DDR3 - 2 GB - SO DIMM 204-PIN - 1333 MHz / PC3-10600 - ungepuffert - nicht-ECC - für Sony VAIO S Series VPC-SB3M9E Gruppe RAM Hersteller MemorySolutioN Hersteller Art. Nr. MS2048SON-NB153 Modell EAN/UPC 4047762484385 Produktbeschreibung: MemorySolutioN - DDR3 - 2 GB - SO DIMM 204-PIN Produkttyp RAM-Speicher Kapazität 2 GB Speichertyp DDR3 SDRAM - SO DIMM 204-PIN Erweiterungstyp Systemspezifisch Datenintegritätsprüfung Nicht-ECC Geschwindigkeit 1333 MHz (PC3-10600) Leistungsmerkmale Ungepuffert Entwickelt für Sony VAIO S Series VPC-SB3M9E Ausführliche Details Allgemein Kapazität 2 GB Erweiterungstyp Systemspezifisch Speicher Typ DRAM Technologie DDR3 SDRAM Formfaktor SO DIMM 204-PIN Geschwindigkeit 1333 MHz (PC3-10600) Datenintegritätsprüfung Nicht-ECC Besonderheiten Ungepuffert Informationen zur Kompatibilität Entwickelt für Sony VAIO S Series VPC-SB3M9E
HyperX HX316LS9IB/8 is a 1G x 64-bit (8GB) DDR3L-1600 CL9 SDRAM (Synchronous DRAM) 2Rx8, low voltage, memory module, based on sixteen 512M x 8-bit DDR3 FBGA components. This module has been tested to run at DDR3L-1600 at a low latency timing of 9-9-9 at 1.35V or 1.5V. Additional timing parameters are shown in the PnP Timing Parameters section below. Impact makes your game hotter while keeping your system cool. It has low voltage settings at 1.35V for less power consumption, reduced heat generation and quiet computing. Its slim, sleek new look lets you stand out in the crowd while the thin thermal label allows for installation in slim or ultra-slim notebooks. Best of all, HyperX Impact delivers high performance at a low cost. It's gamer-approved and backed by a lifetime warranty, free technical suppot and legendary liability. Key Features SO-DIMM form factor - features stylish and slim thermal label for an easy fit Easy to install - automatic overclocking; plug-and-play functionality means no adjustments in BIOS needed Eco-friendly - low voltage settings for cooler and quieter computing Reliable - 100-percent factory tested Guaranteed - lifetime warranty, free technical support Auto overclock up to 2400MHz Low voltage setting at 1.35V Slim and sleek new look compatible with ultra-thin notebooks Specifications Capacity: 8 GB Kit Configuration: 1 x 8 GB Speed: PC3-12800 (1600 MHz) Memory Type: DDR3L DIMM Type: 204-Pin SO-DIMM Buffered/Registered: No Error Correction (ECC): Non-ECC Voltage: 1.35/1.5 V CAS Latency: CL9 Memory Rank: Dual Rank Box Contents 1 x Kingston HX316LS9IB/8 Impact 8 GB 1600 MHz DDR3L CL9 SODIMM 1.35 V SODIMM Notebook Memory Module, Black
... DDR4 FBGA components. Total kit capacity is 64GB. Each module supports Intel Extreme Memory Profiles (Intel XMP) 2.0. This module has been tested to run at DDR4-2400 at a low latency timing of 15-15-15 at 1.2V.FeaturesPower Supply: VDD=1.2V TypicalVDDQ = 1.2V TypicalVPP - 2.5V TypicalVDDSPD=2.2V to 3.6VOn-Die termination (ODT)16 internal banks; 4 groups of 4 banks eachBi-directional Differential Data Strobe8-bit pre-fetchBurst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)Height 1.18 inches (30.00mm)Extra InfoMemory Size: 65536MBModule Size: 16384MBMemory Type: DDR4Memory Package: SO-DIMMDesignation: PC4-19200Pin Configuration: 260 pinsMain Colour: Black
