Schneider Electric APC Rack Air Containment End Caps - Air Containment System - Schwarz (ACCS1002)

Features: Scan: It supports paper printing bar code, screen bar codes such as mobile phones and computers with higher precision of scanning. Billing: It is also a billing device, compatible with all billing formats, it can quickly realize WeChat and payment receipt. Anti-falling: The ability to resist falling can reach 2m so it can avoid the risk of downtime caused by falling work. Application: Compatible with USB, KB, RS232 and other data interfaces, can meet customers' different application scenarios. Suitable: The industrial three-defense design suitable for commercial, payment, express, logistics, medical, health and tobacco.

Features: Creative eco-friendly toy - develop your artistic skills and spatial thinking. Temperature adjustable, work with 1.75mm PLA and ABS filament. Sent with 3pcs PLA filament sample, each 3m long, random color. Slip the speed controller to adjust different speeds for drawing different shapes. Double clip the loading button to trigger auto filament loading. With working indicator, red for power on, flashing green for warming up, green for ready. Sent with a power adapter; And you can connect the USB cable to 5V 2A power pack to draw outdoor.

Kurzinfo: Enermax LiqTech II 360 - Prozessor-Flüssigkeitskühlsystem - (für: LGA1156, AM2, AM2+, LGA1366, AM3, LGA1155, AM3+, LGA2011, FM1, FM2, LGA1150, FM2+, LGA2011-3, LGA1151, AM4, LGA2066) - Kupfer - 120 mm - Schwarz Gruppe Systemzubehör Hersteller Enermax Hersteller Art. Nr. ELC-LTTO360-TBP Modell LiqTech II 360 EAN/UPC 4713157723604 Produktbeschreibung: Enermax LiqTech II 360 - Prozessor-Flüssigkeitskühlsystem Produkttyp Prozessor-Flüssigkeitskühlsystem Packungsinhalt Wärmeleitpaste, Befestigungsteile Farbe Schwarz Kompatibilität LGA1156 Socket, Socket AM2, Socket AM2+, LGA1366 Socket, Socket AM3, LGA1155 Socket, Socket AM3+, LGA2011 Socket, Socket FM1, Socket FM2, LGA1150 Socket, Socket FM2+, LGA2011-3 Socket, LGA1151 Socket, Socket AM4, LGA2066 Socket Kühlermaterial Kupfer Gebläseanzahl Dreifach Lüfterdurchmesser 120 mm Gebläsehöhe 25 mm Lüfterlager Twister Bearing Drehgeschwindigkeit 500 - 2300 U/min Luftstrom 40,45 - 173,59 mü/h (23,81 - 102,17 CFM) Geräuschpegel 14-28 dBa Nennspannung

Features: Advanced 3D Printing Technology -- Foamed with innovative 3D printing technology, layer by layer stacking to perfectly restore the lunar surface. Dual Color Temperature -- Cool White (6000K) Warm Yellow (3000K), different light effect brings you different feelings. Eco-friendly Material -- Healthy PLA material, odourless and non-toxic. Convenient Design -- Rechargeable battery and can be charged via the USB cable. Mysterious Romantic Gift -- Creative gift for your relatives and friends.

Kurzinfo: Intel Server Chassis R1304WFXXX - Rack - einbaufähig - 1U - ohne Netzteil Gruppe Systemgehäuse Hersteller Intel Hersteller Art. Nr. R1304WFXXX EAN/UPC 5032037105439 Produktbeschreibung: Intel Server Chassis R1304WFXXX - Rack - einbaufähig - 1U Produkttyp Systemschrank Formfaktor Rack - einbaufähig - 1U Stromversorgungsgerät Ohne Netzteil Abmessungen (Breite x Tiefe x Höhe) 43 cm x 71 cm x 4.37 cm Ausführliche Details Allgemein Formfaktor Rack - einbaufähig - 1U Anzahl Hot-Swap-Einbauschächte 4 Kühlsystem Lüfter x 6 Erweiterung / Konnektivität Erweiterungseinschübe 4 (gesamt)/ 4 (frei) x Hot-Swap - 2 x 6,4 cm/8,9 cm gemeinsam genutzt (2.5"" / 3.5"" gemeinsam genutzt) Verschiedenes Zubehör im Lieferumfang SAS3-Backplane, I2C-Kabek, Schalttafel, 2 x Prozessorkühler, Netzkabel, 2 x Geräterahmen-Griffe, 6 x fans, 3.5"" hot-swap drive bays, 4 x 3.5"" hot-swap drive toolless carriers, 2 x standard CPU carriers, 8 x DIMM-Steckplatzabdeckungen, chassis stiffener bar, power supply bay blank

Samsung Memory 32GB EVO Plus MicroSDHC 95MB/s UHS-I (U1) Class 10 TF Flash Memory Card MB-MC32GA/CN High Speed for Phone Tablet Cemara